Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires

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ژورنال

عنوان ژورنال: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

سال: 2018

ISSN: 0278-0070,1937-4151

DOI: 10.1109/tcad.2018.2801221